Wednesday, April 1, 2026
8:15 AM to 9:45 AM
Concurrent Sessions
Wednesday, April 1, 2026
Electronics: Advanced Packaging
Session Chair:
Mr Steven Dooley -
USAF AFRL
8:15 AM - 8:45 AM
Establishing FanOut Wafer Level Packaging and Leveraging Silicon Interposer Manufacturing at NeoCity
Presenter: Mr David Box -
SkyWater Technology
8:45 AM - 9:15 AM
Advanced 3D Heterogeneous Integrated Electronic Packaging and Sensors using Glass
Presenter: Mr Robert Hulsman -
3D Glass Solutions
9:15 AM - 9:45 AM
US Advanced Packaging and Biomed 1um flex Substrate Demonstration
Presenter: Mr Douglas Hackler -
American Semiconductor Inc
X CLOSE WINDOW
